Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules

Program
Fulbright U.S. Scholar Program
Program Country
Finland
Grant Activity Type
Lecturer, Research
Discipline
Engineering
Academic Year
2002-2003
Dates
-
Flex
No
Scholar type
U.S. Scholar

Scholar Information

Grantee
Luu Nguyen
Title
Other
Institution
National Semiconductor Corporation
Host Institutions
Institution
Helsinki University of Technology
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