1726520400 U.S. Scholar Application Deadline 2025-2026 COMPETITION | September 16, 2024 at 5:00 PM EST
Home Country United States Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules Program Fulbright U.S. Scholar Program Program Country Finland Grant Activity Type Lecturer, Research Discipline Engineering Academic Year 2002-2003 Dates August 2002 - December 2002 Flex No Scholar type U.S. Scholar Project Title Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules Scholar Information Grantee Luu Nguyen Title Other Institution National Semiconductor Corporation Host Institutions Institution Helsinki University of Technology
Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules Program Fulbright U.S. Scholar Program Program Country Finland Grant Activity Type Lecturer, Research Discipline Engineering Academic Year 2002-2003 Dates August 2002 - December 2002 Flex No Scholar type U.S. Scholar Project Title Electronic Packaging Reliability of Compact Lead-Free Products and Design-for-Manufacturability of Optoelectronic Modules Scholar Information Grantee Luu Nguyen Title Other Institution National Semiconductor Corporation Host Institutions Institution Helsinki University of Technology